The essentials at a glance
- Manual or automated dosing of underfilling, cornerbonding and glob-top materials
- Process reliable preheating of assemblies
- 100% visual monitoring of dosage
- Microsection analyses
Why underfilling | cornerbonding | glob-top?
Underfilling means closing the small gap between a component (usually a BGA) and the circuit board with suitable crosslinkable polymeric materials.
On one hand, the crosslinked underfilling material prevents the capillary movement of unwanted media underneath the component, on the other hand, it provides a mechanical stabilization.
Cornerbonding is an alternative for the mechanical stabilization of parts. The bonding material is dosed onto the four corners of the component which fixes it in place.
In order to protect parts without a housing or to achieve additional strength / robustness, a glob-top can be applied directly onto components.